Skip to main content

Crack formation in thin film during deposition process

Submitted by Ijaz Ahmad Khan on

 

Dear Researchers,  

I am a research student, "Surface modification of materials" is my research topic. I joined your site to discuss the crack propagation during thin film deposition.

I think this topic is very interesting. And I have seen some papers about this topic as follow:

1)Asaro, R.J., Tiller, W.A., 1972. Interface morphology development during stress corrosion cracking: Part I. Via surface diffusion. Metall. Trans. 3, 1789-1796.

2)Freund, L.B., Jonsdottir, F., 1993. Instability of a biaxially stressed thin film on a substrate due to material diffusion over its free surface. J. Mech. Phys. Solids 41, 1245-1264.

3) Freund, L.B., 1995. Evolution of waviness on the surface of a strained elastic solid due to stress-driven diffusion. Int. J. Solids Structures 32, 911-923.

4) Gao, H., 1991. A boundary perturbation analysis for elastic inclusion and interfaces. Int. J. Solids Structures 28, 703-725.

5) Gao, H., 1994. Some general properties of stress-driven surface evolution in a heteroepitaxial thin film structure. J. Mech. Phys. Solids 42, 741-772. 

Btw: Could you give some related fracture modes of the thin film during deposition process?

Fri, 10/26/2007 - 15:39 Permalink