Engineer position at Intel (Hillsboro,OR)

 Intel has a potential opening for an entry-level Engineering position in the area of Thermal Mechanics.  If you would like more information on this position please contact me at li.han@intel.com with current resume. 

Qualifications You must possess the below minimum qualifications to be consider for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience can be obtained through a combination of prior education, current MS/Ph.D. course work, projects, research and any relevant prior job/internships.  

Minimum Qualifications: This is an entry level position for a technical college graduate with an MS or Ph.D. degree in Materials Science, Mechanical Engineering, Physics or related discipline.  In depth understanding of mechanical properties of thin films and fracture mechanics. Minimum 1 year hands-on experience with nanoindentation, four-point bending, stress/strain measurement, and subcritical fracture measurement. 

Preferred Qualifications: o Prior Intel Intern or Scholarship recipient o 6 months experience with statistical packages e.g. JMP or Minitab o 6 months experience in one or more of the following areas: thin film process deposition and characterization, semiconductor device physics, interconnect reliability, reliability statistics. o Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials. o Familiar with material characterization techniques such as SIMS, XPS/Auger, TEM/STEM/SEM or EDX/EELS.o FEM experience in thin film/nanoscale material system is a plus.