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Mini-symposium “Fracture and Instabilities in Soft Materials” on ICF13

Wei Hong's picture

We are organizing a mini-symposium, "Fracture and Instabilities in Soft Materials", on the 13th International Conference on Fracture, which will be held during June 16-21, 2013 in Beijing, China. We would like to invite you to submit an abstract on your recent research findings in related areas. The deadline for abstract submission has now been extended to October 31, 2012.  Instructions on abstract submission can be found at The conference anouncement is at

Please submit your abstract to the mini-symposium no.12
- Fracture and Instabilities in Soft Materials

Mini-symposium description:

Soft materials are materials that deform easily under mechanical or multi-physics loads. Examples of soft materials are engineering materials such as polymers, foams, gels, granular materials, liquids, and colloids, as well as biological tissues. Many of these materials are active: they respond to environmental stimuli in the form of large deformation. Engineering applications of these materials increasingly demand mechanical reliability in addition to the active properties. The fundamental understanding on the failure mechanisms of soft materials, including but not limited to instability phenomena, damage, and fracture, has become an interesting and important topic. This mini symposium aims at bringing together researchers working on mechanics of soft materials to exchange recent advances and to inspire new ideas. Researchers are invited to present their recent work on but not limited to the following topics:

  • Experimental and theoretical research on fracture of soft materials 
  • Experimental and theoretical research on cavitation and other instability phenomena in soft solids and structures
  • Microstructure and damage evolution in soft materials 
  • Development of new soft materials with superior mechanical/physical performance

Wei Hong
Department of Aerospace Engineering
Iowa State University

Oscar Lopez-Pamies
Civil and Environmental Engineering
University of Illinois at Urbana-Champaign


Chuancheng Duan's picture

Dear Wei,

Thanks for your information.


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