Minisymposium: Adhesively Bonded Composite Systems- MECHCOMP2014 , NY

30th October 2013
- Deadline for submission of abstracts (a text of 4000 characters max.)

Contributions are
invited for a session on Adhesively bonded composite systems (Session
:39),  covering both computational and
experimental aspects of adhesively bonded systems for the 1st  International Conference on Mechanics of
Composites (MECHCOMP2014) that will be hosted by
Stony Brook University (Long Island, New York). The Conference will take
place from 8-12 June 2014. Topics include but not limited to composite joints,
crack-patch repairs, and bonded electronic assemblies

https://sites.google.com/site/mechcomp2014/

After the conference, you can submit a full-length
paper for review and possible publication in Composite Structures (an
international journal by Elsevier).