SES-2017: Mechanics and Physics of Soft Materials -- Call for abstracts

Dear Colleagues,

The 54th Annual Technical Meeting of the Society of Engineering Science, a joint event with the Applied Mechanics Division of the American Society of Mechanical Engineers, will be hosted by Northeastern University, on July 25-28, 2017 at its Boston campus. As part of this meeting, we are organizing a symposium to address recent experimental, computational, theoretical and manufacturing advances in the research area of Mechanics and Physics of Soft Materials. Topics of particular interest include (but not limited to):

• Electroactive and magnetoactive elastomers (EAP, DE, MRE, MAE)
• Hydrogels and soft wet materials
• Liquid crystal elastomers
• Shape-memory and light-sensitive polymers
• Ionic Polymer-Metal Composites (IPMC)
• Microstructural instabilities, fracture, and adhesion in soft materials
• Soft biological and bio-inspired materials
• Multiphysics phenomena in soft materials
• Wave propagation in soft materials
• 3D/4D printing and fabrication of soft materials
• Soft Robotics or Machines

To submit your abstract, please visit the conference website or abstract submission webpage or click "submit abstract" at the symposium description page

Symposium VII-C: Mechanics and Physics of Soft Materials

The deadline for abstract submission is April 15, 2017.

We look forward to seeing you in Boston this summer!

S. Rudykh, Technion, Israel Institute of Technology

T. Sain, Michigan Technological University

Y. Hu, University of Illinois Urbana-Champaign

O. Lopez-Pamies, University of Illinois Urbana-Champaign

X. Zhao, Massachusetts Institute of Technology

L. Jin, University of California Los Angeles