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[Call for Abstracts: SES 2017] Track IX-B: Mechanics of 3D Printed Materials and Structures (Due: April 15, 2017)

Sung Hoon Kang's picture

Dear Colleagues, 

We would like to invite you to submit an abstract to the symposium on “Track IX-B: Mechanics of 3D Printed Materials and Structures” at the 54th Annual Technical Meeting of the Society of Engineering Science (SES) to be held from July 25 to July 28, 2017 at Northeastern University in Boston, MA 

Additive manufacturing, also known as 3D printing, offers unique opportunities to explore novel properties and mechanics of materials and structures, with its ability to spatially control material constituents. This symposium calls for abstracts from research efforts related to materials and structures with novel mechanical properties/behaviors realized via 3D printing techniques. Specific topics of interest include, but are not limited to:

-  Novel 3D printing methods for stimuli-responsive materials

-  3D printed metamaterials with novel properties and functionalities, such as unique acoustic properties, negative Poisson’s ratio, negative stiffness etc.

-  3D printed active materials with programmable deformation and/or active modulation of physical properties

-  3D printed bio-inspired and bio-compatible materials

-  Design theory or methodology for 3D printed materials and structures

-  Constitutive modeling and computational simulation of 3D printed materials and structures

-  Applications of 3D printed materials and structures

-  Instabilities and failure in 3D printed materials

  

You can submit your abstract through abstract-submission-portal (link). 

Abstract submission deadline for SES 2017 will be SATURDAY, April 15, 2017.

Should you have any questions, please feel free to contact us. We look forward to receiving your contributions and seeing you in Boston.

  

Sung Hoon Kang, Johns Hopkins University

Howon Lee, Rutgers University

Yaning Li, University of New Hampshire

Kathryn Matlack, University of Illinois at Urbana-Champaign 

Jordan R. Raney, University of Pennsylvania

Stephan Rudykh, Technion-Israel Institute of Technology

Lifeng Wang, Stony Brook University

Jie Yin, Temple University

Kai Yu, University of Colorado – Denver

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