SES-2019: Mechanics and Physics of Soft Materials -- Call for abstracts

Dear Colleagues:  the 56th Annual Technical Meeting of the Society of Engineering Science will be hosted by Washington University in St. Louis on October 13-15, 2019. As part of this meeting, we are organizing a Symposium (7.3) to address recent experimental, computational, theoretical and manufacturing advances in the research area of Mechanics and Physics of Soft Materials. Topics of particular interest include (but not limited to):

•Electroactive and magnetoactive elastomers (EAP, DE, MRE, MAE, IPMC)

•Hydrogels and other soft wet materials 

•Liquid crystal elastomers

•Shape-memory and light-sensitive polymers

•Instabilities in soft materials

•Fracture, and adhesion in soft materials

•Soft biological and bio-inspired materials

•Multiphysics phenomena in soft materials

•Wave propagation and dynamics of soft materials

•3D/4D printing and fabrication of soft materials

•Soft Robotics or Machines

•Mechanical Metamaterials

To submit your abstract, please visit the conference website or abstract submission webpage 

The deadline for abstract submission is April 30, 2019.

We look forward to seeing you in St. Louis this October!

On behalf of the symposium organizers,

Shengqiang Cai, University of California San Diego

Shawn Chester, New Jersey Institute of Technology

Noy Cohen, Technion-Israel Institute of Technology

Stephan Rudykh, University of Wisconsin-Madison

Meredith Silberstein, Cornell University

J. El-Awady, Johns Hopkins University

Yuhang Hu, Georgia Institute of Technology

Lihua Jin, University of California Los Angeles

Sung Hoon Kang, Johns Hopkins University

Marisol Koslowski, Purdue University

Christian Linder, Stanford University

Oscar Lopez-Pamies, University of Illinois at Urbana-Champaign

Robert M. McMeeking, University of California Santa Barbara

Qiming Wang, University of Southern California

Xuanhe Zhao, Massachusetts Institute of Technology