SES 2019 : Symposium on "Mechanics of deformable atomically-thin materials"

 Dear Colleagues, 

Please consider submitting your abstract to our mini-symposium on "Mechanics of deformable atomically-thin materials (Symposium 8.2)" at the 56th Annual Technical Meeting of the Society of Engineering Science (SES), Washington University in St. Louis, October 13-15, 2019. 

LINK TO THE ABSTRACT SUBMISSION    (Deadline - April 30, 2019)

 Symposium 8.2: Mechanics of deformable atomically-thin materials

Co-Chairs:

SungWoo Nam, University of Illinois at Urbana-Champaign

Baoxing Xu, University of Virginia

Dibakar Datta, New Jersey Institute of Technology

Susanta Ghosh, Michigan Technological University

Summary:

Many mechanical deformations, such as wrinkling, buckling, crumbling, collapsing, and delamination, are usually considered as threats to mechanical integrity and are avoided or reduced in the traditional design of materials and structures. However, the careful control of materials systems and applied stresses enable the tailoring of such instabilities to deterministically enable mechanically coupled properties. In particular, in atomically-thin material systems (such as graphene, BN, MoS2, WS2, Si nano-membranes, etc.), an unprecedented opportunity for designer mechanically coupled properties lies with their ability to experience elastic strain on the order of several percents without releasing that energy via dislocation formation or other inelastic relaxation mechanisms. Mechanically coupled properties also allow for new functionalities and device architectures previously unachievable.

This symposium will cover fundamental mechanics theory and modeling of atomically-thin materials, ranging from novel computational modeling of 2D crystalline materials to mechanics-driven manufacturing technique, to mechanical controlling of properties, to design of functional devices and structures by mechanics. The symposium will discuss advances in material processing for controlled deformation and straining of atomically-thin materials. Furthermore, the symposium will also focus on how such controlled deformation and straining will lead to the mechanically coupled properties, including thermal, optical, electrical, magnetic, mechanical and/or hybrid properties.

Interdisciplinary topics related to mechanics, physics, and materials science and engineering will be presented by invited speakers in order to accelerate the development of these new forms of materials and applications. Interdisciplinary presentations from invited speakers are also aimed to motivate synergistic research collaborations in the field of mechanics of deformable and strained atomically-thin materials.

Topics addressed in this symposium will include (but not be limited to):

• Theory and modeling of deformation mechanics of atomically-thin materials
• Applications of machine learning/Data science for research on 2D materials (data-driven modeling)
• Atomistic-continuum modeling of growth mechanics of 2D materials such as graphene or TMD on different substrates/2D materials and growth parameters
• Controlled deformation (e.g., wrinkling, folding, buckling, crumbling, assembly, etc.) of atomically-thin materials
• Strain engineering of atomically-thin materials
• Mechanics in the manufacturing of atomically-thin materials
• Mechanically-coupled thermal, optical, electrical, magnetic and/or hybrid properties of deformable/strained atomically-thin materials
• Flexible, stretchable and shape adaptive devices based on atomically-thin materials
• Various applications of 2D materials such as energy storage, environmental protection, water purifications, healthcare, etc.