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Call for abstracts - SES-2020: Controlling Wave Propagation Via Architected Structures And Metamaterials: Theory, Simulation, Fabrication, And Experimentation

Jian_Li's picture

Dear Colleagues, 

We cordially invite you to submit an abstract for the mini-symposium on “Controlling Wave Propagation Via Architected Structures And Metamaterials: Theory, Simulation, Fabrication, And Experimentation” at the 57th Annual Technical Meeting of the Society of Engineering Science to be held at Hyatt Regency Minneapolis, Minnesota, September 28-30, 2020. 

This mini-symposium aims to bring together experts to discuss the latest findings in computational, theoretical, experimental, and fabrication aspects in the broad area of mechanical wave propagation and its control via architected structures and metamaterials. The central theme of the symposium focuses on tunable metamaterials with unique and unusual properties, and the advancement of fabrication methods for realization of acoustic/elastic metamaterials at different length scales. Contributions concerning the application of additive manufacturing to enable the fabrication of structured materials with unique properties are also strongly encouraged. We hope the symposium will facilitate the discussion of potential engineering applications of the phenomenon.

Topics of interest include (but not limited to):

  •  wave propagation in soft materials
  • acoustic-elastic metamaterials
  • phononic crystals and cloaking materials
  • homogenization and topological optimization of acoustic-elastic metamaterials
  • non-reciprocal and directional waves
  • wave controlling via multiphysics phenomena

You can submit your abstract using the following link (our session is listed under track 10 – Metamaterials, Architected Solids, and Manufacturing)

https://ccaps.umn.edu/SES/abstract-submission

The deadline for abstract submission is March 17, 2020.

We look forward to your contribution and seeing you in Minnesota!

 

On behalf of organizers:

Fabio Semperlotti, Purdue University

Guoliang Huang, University of Missouri

Jian Li, Massachusetts Institute of Technology

Stephan Rudykh, University of Wisconsin, Madison

Kathryn Matlack, University of Illinois at Urbana-Champaign

Dennis M. Kochmann, ETH Zurich

Ramathasan Thevamaran, University of Wisconsin, Madison

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