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Statistics of Electromigration Lifetime Analyzed Using a Deterministic Transient Model

Jun He's picture

void due to electromitationThe electromigration lifetime is measured for a large number of copper lines encapsulated in an organosilicate glass low-permittivity dielectric. Three testing variables are used: the line length, the electric current density, and the temperature. A copper line fails if a void near the upstream via grows to a critical volume that blocks the electric current. The critical volume varies from line to line, depending on line-end designs and chance variations in the microstructure. However, the statistical distribution of the critical volume (DCV) is expected to be independent of the testing variables. By contrast, the distribution of the lifetime (DLT) strongly depends on the testing variables. For a void to grow a substantial volume, the diffusion process averages over many grains along the line. Consequently, the void volume as a function of time, V(t), is insensitive to chance variations in the microstructure. As a simplification, we assume that the function V(t) is deterministic, and calculate this function using a transient model. We use the function V(t) to convert the experimentally measured DLT to the DCV. The same DCV predicts the DLT under untested conditions.

Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004

Applied Physics Letters 85, 4639-4641 (2004)


Zhigang Suo's picture

Here is a report on cnet, along with comments on slashdot.

Nanotoday published a news in Dec. 2005 about the replacement of Cu by carbon nanotubes, conducted by Jie Liu and his team in Duke. Here is the link

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