CDI Marine Band Lavis Division is seeking individuals with skills in
engineering and software development in the Baltimore, MD area
(relocation assistance available) for full-time work on exciting,
research-oriented marine engineering projects. CDI is a large, stable
company of which Band Lavis Division is a small, profitable division
with a laid back atmosphere and small-company flexibility.

Candidates should be quick learners, enthusiastic workers, and have
strong technical expertise. The following skills, knowledge, and
passions are sought:

- Python, C, C++, and Fortran knowledge and experience: Our current work
is mostly Python but there will certainly be C development for
performance and library bindings.

Hi,

I'm an Engineer and a Ph.D. student in Applied Maths, working in the field of Nonlinear Finite Elements for Elasticity. I often think about my future career since, by now, I have a strong experience with coding FE in C++/Matlab/Mathematica, but no clue whatsoever about commercial black-box softwares for FEA. I'm worried about this, since most of the job vacancies from the industry (I'm not interested in pursuing the Academic career) seem to require only experience with a specific software and application, and not to directly code FE.

PhD available at the University of Glasgow entitled ‘Numerical Simulation of Fault Evolution in Oil Reservoirs’ 

EPSRC Case Award with Schlumberger - £15,500 per annum + fees. 

A year ago in my first post, The Future of Ink, I explored e-ink technology and the e-book concept when the potential was still largely unseen. But since then, the industry has completely transformed, and the prospect of the e-book is beginning to be realized.

E2 Solutions offer services like seo, link building, e-mail marketing, blog & article marketing.

Seo Delhi   SEO India SEO Company

See attachment for announcement of a Structural FEA Engineer position at Schlumberger's Sugar Land Product Center
 in Sugar Land, Texas.  If interested, please respond to Sepand Ossia (sossia@slb.com).

Simpleware Ltd., the world leader in image-based meshing software, has signed a reseller agreement with Vangest Group, a provider of most advanced solutions in project, development and manufacturing.

ITherm (http://www.ithermconference.org/) and ECTC (http://www.ectc.net/) are two important conferences in electronic packaging and systems. They are normally located at the same hotel and the same time. The attendees can register for both confercences by paying $100 extra. The total attendance of the two conferences is about 1500. The page counts of the proceedings of the two conferences together is more than 1600 every year. ITherm is more modeling and simulation focused. It is a very good opportunity for mechanicians to meet enigeers in semiconductor industry.

ITherm 2008

As another celebration of March Journal Club of Mechanics of Flexible Electronics, this paper has just been submitted.

Abstract 

In one design of flexible electronics, thin-film islands of a stiff material are fabricated on a polymeric substrate, and functional materials are grown on these islands. When the substrate is stretched, the deformation is mainly accommodated by the substrate, and the islands and functional materials experience relatively small strains. Experiments have shown that, however, for a given amount of stretch, the islands exceeding a certain size may delaminate from the substrate. We calculate the energy release rate using a combination of finite element method and complex variable method. Our results show that the energy release rate diminishes as the island size or substrate stiffness decreases. Consequently, the critical island size is large when the substrate is compliant. We also obtain an analytical expression for the energy release rate of debonding islands from a very compliant substrate.

By Martijn Feron, Zhen Zhang and Zhigang Suo

The mobility of charge carriers in silicon can be significantly increased when silicon is subject to a field of strain.In a microelectronic device, however, the strain field may be intensified at a sharp feature, such as an edge or a corner, injecting dislocations into silicon and ultimately failing the device. The strain field at an edge is singular, and is often a linear superposition of two modes of different exponents. We characterize the relative contribution of the two modes by a mode angle, and determine the critical slip systems as the amplitude of the load increases. We calculate the critical residual stress in a thin-film stripe bonded on a silicon substrate.