industry

I am deeply saddened by the passing of Andre Pineau in Paris yesterday. I happened to be one of ~100 PhD students he graduated over the course of his career.

Atlanta-based Novelis Inc. and Georgia Tech have announced a new collaboration to establish the Novelis Innovation Hub at Georgia Tech. The company has committed $2.5 million to initiate research, faculty, student, and educational program support. The collaboration will promote basic and translational research, innovative business models, and related educational endeavors at Georgia Tech and will serve as a cross-functional hub connecting Novelis’ technical and business innovators with Georgia Tech’s students and faculty.

Contact Email: mqu@slb.com

Job Title                                Internship in Materials for O&G

Duration                                2018, 4-6+ months

International Applications   Yes, for 6+ months

Location                                 Schlumberger-Doll Research, Cambridge, MA, US

Advanced Course at the International Centre for Mechanical Sciences (CISM, Udine, Italy)

Modelling and Simulation of Tribological Problems in Technology

May 28, 2018 — June 1, 2018 

Coordinators:

Marco Paggi (IMT School for Advanced Studies Lucca, Lucca, Italy)

David A. Hills (University of Oxford, Oxford, Great Britain)

Now accepting Case Studies! 

CDI Marine Band Lavis Division is seeking individuals with skills in
engineering and software development in the Baltimore, MD area
(relocation assistance available) for full-time work on exciting,
research-oriented marine engineering projects. CDI is a large, stable
company of which Band Lavis Division is a small, profitable division
with a laid back atmosphere and small-company flexibility.

Hi,

I'm an Engineer and a Ph.D. student in Applied Maths, working in the field of Nonlinear Finite Elements for Elasticity. I often think about my future career since, by now, I have a strong experience with coding FE in C++/Matlab/Mathematica, but no clue whatsoever about commercial black-box softwares for FEA. I'm worried about this, since most of the job vacancies from the industry (I'm not interested in pursuing the Academic career) seem to require only experience with a specific software and application, and not to directly code FE.

PhD available at the University of Glasgow entitled ‘Numerical Simulation of Fault Evolution in Oil Reservoirs’ 

EPSRC Case Award with Schlumberger - £15,500 per annum + fees. 

A year ago in my first post, The Future of Ink, I explored e-ink technology and the e-book concept when the potential was still largely unseen. But since then, the industry has completely transformed, and the prospect of the e-book is beginning to be realized.

See attachment for announcement of a Structural FEA Engineer position at Schlumberger's Sugar Land Product Center
 in Sugar Land, Texas.  If interested, please respond to Sepand Ossia (sossia@slb.com).

As another celebration of March Journal Club of Mechanics of Flexible Electronics, this paper has just been submitted.

Abstract 

In one design of flexible electronics, thin-film islands of a stiff material are fabricated on a polymeric substrate, and functional materials are grown on these islands. When the substrate is stretched, the deformation is mainly accommodated by the substrate, and the islands and functional materials experience relatively small strains. Experiments have shown that, however, for a given amount of stretch, the islands exceeding a certain size may delaminate from the substrate. We calculate the energy release rate using a combination of finite element method and complex variable method. Our results show that the energy release rate diminishes as the island size or substrate stiffness decreases. Consequently, the critical island size is large when the substrate is compliant. We also obtain an analytical expression for the energy release rate of debonding islands from a very compliant substrate.

By Martijn Feron, Zhen Zhang and Zhigang Suo

The mobility of charge carriers in silicon can be significantly increased when silicon is subject to a field of strain.In a microelectronic device, however, the strain field may be intensified at a sharp feature, such as an edge or a corner, injecting dislocations into silicon and ultimately failing the device. The strain field at an edge is singular, and is often a linear superposition of two modes of different exponents. We characterize the relative contribution of the two modes by a mode angle, and determine the critical slip systems as the amplitude of the load increases. We calculate the critical residual stress in a thin-film stripe bonded on a silicon substrate.