Dear all,
Many numerical implementation of plasticity model uses spectral decomposition to represent the Cauchy stress, elastic strain, such that stress update algorithm is written in the principal directions. As a result, I wonder what makes it benefical to write the stress update algorithm in spectral form?
Thanks,
WaiChing Sun
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In my opioion, the traditional concrete model is taking the smeared cracking concept to deal with the tensile cracking and using the elastoplastic method to deal with the compressive softening.
We can find that recently the CDM based concrete model become a hot research subject.
But what are the advantages of the CDM-based?
Thank you very much!
I could not find a detailed book about micromechanical finite element modelling. There are some books about micromechanics but They do not consist extensive micromechanical finite element. Could anyone suggest me a detailed book about that?
The difference to the common model used is the f,g terms. The 3D FEM formulation has been derived and a new fortran program is written. The derivative matrix is symmetric. But the calculation result does not converge. I have tried every means to get a converging result. But it doesn't work, the residual norm always increases.
For large deformation, we have various deformation measures such as Green-Lagrange tensor, Almansi strain tensor, left Cauchy-Green deformation tensor, and right Cauchy-Green deformation tensor. Appreciate very much any explanation in respect to physical differences of those measures, why they are necessary, conditions where one is more accurate than another! Thank you.
Upa-
Hi Everyone,
I am new to thermal viscosity analysis, here is the data I have received.
DMA data which has Temp, Shear Storage Modules, Shear Loss Modules, Tan Delta, Calculated Modules, Temp was raised at 5 deg/Min
I want to do a thermal analysis where the part is heated upto 90 deg for 1 hr, returned to room temp and cooled 2 hours.
How can i simulate this in abaqus ..? I want to incorporate the Viscosity data from the DMA data. I also have received thermal conductivity, thermal expansion and specific heat data.
Dear friends,
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