Effect of Residual stresses on the Interfacial Fracture Toughness of polymer/Metal Interface
When a bi-material sample for the characterization of interfacial fracture toughness is manufactured, the sample is not usually stress-free at room temperature. If an interface between a metallic substrate and a polymeric adhesive is considered, there are essentially two sources of residual stresses for a dry sample at room temperature:
1- The mismatch between the Coefficient of Thermal Expansion (CTE) of adhesive and substrate induces a concave or convex warpage, depending on the CTE values of the two materials.