It is well-recognized that MEMS switches, compared to their more traditional solid state counterparts, have several important advantages for wireless communications.  These include superior linearity, low insertion loss and high isolation.  Indeed, many potential applications have been investigated such as Tx/Rx antenna switching, frequency band selection, tunable matching networks for PA and antenna, tunable filters, and antenna reconfiguration. 

However, none of these applications have been materialized in high volume products to a large extent because of reliability concerns, particularly those related to the metal contacts.  The subject of the metal contact in a switch was studied extensively in the history of developing miniaturized switches, such as the reed switches for telecommunication applications.  While such studies are highly relevant, they do not address the issues encountered in the sub 100mN, low contact force regime in which most MEMS switches operate.  At such low forces, the contact resistance is extremely sensitive to even a trace amount of contamination on the contact surfaces.  Significant work was done to develop wafer cleaning processes and storage techniques for maintaining the cleanliness.  To preserve contact cleanliness over the switch service lifetime, several hermetic packaging technologies were developed and their effectiveness in protecting the contacts from contamination was examined.  

Stresses inevitably arise in a microelectronic device due to mismatch in coefficients of thermal expansion, mismatch in lattice constants, and growth of materials. Moreover, in the technology of strained silicon devices, stresses have been deliberately introduced to increase carrier mobility. A device usually contains sharp features like edges and corners, which may intensify stresses, inject dislocations into silicon, and fail the device. On the basis of singular stress fields near the sharp features, this letter describes a method to obtain conditions that avert dislocations.

In a recent article in Physical Review Letters, Alain Goriely and Sébastien Neukirch offer a mechanical model of how the free tip of a twining plant can hold onto a smooth support, allowing the plant to grow upward. The model also explains why these vines cannot grow on supports of too large a diameter. Read more.

The mechanics involves large deflection and bifurcation of a rod. I hope to hear opinions from people who know about the mechanics of plants.

Applications are invited from suitably qualified candidates for a University Lectureship in Solid Mechanics, which falls within the Mechanics, Materials and Design Division of the Engineering Department. The successful candidate will take up the appointment as soon as possible.

The lectureship has recently been endowed by David and Susan Hibbitt, and the aim is to attract a high calibre researcher with a record of scholarship and research in experimental, computational and/or theoretical solid mechanics. Expertise is required in the mechanics of materials (structural, biological or energy materials, for example) and the successful candidate is expected to make a significant contribution to the Department’s teaching and research activities and to build a strong, externally funded research programme. The activity will fit within the Cambridge Centre for Micromechanics, which is an inter-departmental, inter-disciplinary research group housed within the Engineering Department.

Biomechanics is a reasonably well-developed field of study, with a modern history usually linked to the pioneering work of Prof. Y.C. Fung in the 1960s. There are a number of dedicated biomechanics journals (including but not limited to the Journal of Biomechanics and the Journal of Biomechanical Engineering). The field is well-enough established to have several generations of researchers working on the subject at universities across the world.

Symposium DD at the upcoming Materials Research Society Annual Meeting (Nov. 26-Dec. 1, Boston, MA) will be the latest in a series of MRS symposia on the mechanics of biological materials and materials designed following natural principles ("biomimetic" or "bio-inspired").   The full program is available at the MRS website (www.mrs.org).  This topic was also the subject of the August, 2006 focus issue of the Journal of Materials Research, which contained over 30 articles on the subject.

The electromigration lifetime is measured for a large number of copper lines encapsulated in an organosilicate glass low-permittivity dielectric. Three testing variables are used: the line length, the electric current density, and the temperature. A copper line fails if a void near the upstream via grows to a critical volume that blocks the electric current. The critical volume varies from line to line, depending on line-end designs and chance variations in the microstructure. However, the statistical distribution of the critical volume (DCV) is expected to be independent of the testing variables. By contrast, the distribution of the lifetime (DLT) strongly depends on the testing variables. For a void to grow a substantial volume, the diffusion process averages over many grains along the line. Consequently, the void volume as a function of time, V(t), is insensitive to chance variations in the microstructure. As a simplification, we assume that the function V(t) is deterministic, and calculate this function using a transient model. We use the function V(t) to convert the experimentally measured DLT to the DCV. The same DCV predicts the DLT under untested conditions.

A viscous-elastic-plastic indentation model was used to assess the local variability of properties in healing porcine bone. Constant loading- and unloading-rate depth-sensing indentation tests were performed and properties were computed from nonlinear curve-fits of the unloading displacement-time data. Three properties were obtained from the fit: modulus (the coefficient of an elastic reversible process), hardness (the coefficient of a nonreversible, time-independent process) and viscosity (the coefficient of a nonreversible, time-dependent process). The region adjacent to the dental implant interface demonstrated a slightly depressed elastic modulus along with an increase in local time-dependence (lower viscosity); there was no clear trend in bone hardness with respect to the implant interface.