breit's blog

Dear colleagues,  

We are pleased to invite you to contribute to the invited mini-symposium we are organizing entitled "Computational Techniques for Nanocomposite and Nanostructured Materials Modeling" at COMPLAS 2025.  

COMPLAS 2025, the 18th edition of the renowned COMPLAS conference series, will be held as usual in Barcelona (Spain). This conference is a well-established forum for discussing advances in computational plasticity and related topics, bringing together experts worldwide.  

UTC is pleased to announce the start of the second year of the MSCI master in Interacting Complex Systems, taught in English.

MSCI delivers a national master diploma fully accredited by French Ministry of Higher Education.

Course modules tie in with the Labex MS2T (Laboratory of Excellence in Control of Technological Systems-of-Systems) research program. They are drawn from the areas of expertise of the laboratories.

1- Research areas 

General area :

The battery is known for its strict requirement of the lowest maximum allowed working temperature in the entire electric transmission chain assembly.  This poses a problem particularly in climates with extreme temperature variations (35-45°C in summer and 0 to -30°C during winter) and during fast recharging at a significant battery power level.

Call for Abstracts (Deadline: November 30, 2011)

As a part of WCCM 2012 (10th World Congress on Computational Mechanics)

Submit Your Abstract (Choose mini-symposium MS-073)

Organizers: Piotr Breitkopf, Weihong Zhang, Rajan Filomeno Coelho 

We are currently seeking a PhD student to pursue research project within the Roberval Laboratory at Université de Technologie de Compiègne, France. The position is available in the scope of the OASIS project "Optimization of Addendum Surfaces In Stamping" involving several French academia and industrial partners.

The overall goal of the project is to propose methodologies to optimize the process parameters for service properties of high elastic steel parts, while taking into account the residual stresses due to the stamping process. 

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