I taught this course at the University of California, Santa Barbara, in Winter 1994, Winter 1995, Spring 1996; at Princeton, Spring 2003; at Harvard, Spring 2004. The notes posted here are those distributed to the class in Spring 2004.
We describe ratcheting plastic deformation in a thin-film structure
We describe an example of self-assembly driven by electric field
We introduce surface stress, and show how it might drive self-assembly.
Semiconductor particles in the size rage 1-100 nm have special optoelectronic properties dictated by the quantum mechanics of the potential well. These particles are known as quantum dots. Fabricating structures in this size range has been a great challenge of our time. Self-assembly has become an attractive method to fabricate quantum dots. By 1990, it was known that when Ge was deposited on Si substrate, cube on cube, the Ge film is flat up to a few monolayers, and then forms three-dimensional islands.
In service, an interconnect line carries an intense electric current. The conduction electrons impact metal atoms, and motivate the atoms to diffuse in the direction of electron flow. The process, known as electromigration, has been the most menacing and persistent threat to interconnect reliability.
Early aluminum lines had the width much larger than the thickness. They behaved like blanket films. When narrow aluminum lines were introduced, in early 1980s, with the width comparable to the thickness, voids were observed in such narrow interconnects on wafers held in ovens, or even on wafers left on shelves at room temperature. The voids may sever the interconnects.
A polycrystal, held at temperature for some time t, the average grain diameter grows. A grain grows at the expense of its neighbors: small grains disappear and big ones get bigger. Total number of atoms is conserved.
Hull and Rimmer (1959) studied grain boundary cavitation. Small voids were observed at grain boundaries, particularly those transverse to the applied tensile stress. Fracture results from the growth and coalescence of these voids.
I am a freshman in micromechanics area. Many books and papers always say the linear elastic equilibrium equation(Someone also called Navier type function) could be solved with Green Function and Fourier Transformation, but without details. May be the writers think anyone should know these two popular methods in solving the PDE. I have search many books(both mathmatic and mechanics), However, there are little information about solving the navier type function with those two methods.
