ES 240 Project: Stress in Flip-Chip Solder Bumps due to Semiconductor Die Warpage
Please see the attached file for details.
Please see the attached file for details.
Hi,
if I have a material model defined in cauchy stress then I use test data with true stress (calculated from nominal stress: sigma_true=sigma_nom(1+epsilon_nom).
If I wanted to use nominal stress data, which stress tensor would I have to use to define my material model? First or second Piola Kirchhoff?
Andreas
Mar 05, 2009
This position has been filled. Thanks for reading and applying.
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My doubt is in transient dynamic analysis.
take a simple model of 40*2*1 m dimensions.Applying brick45 material. with e=2.069e11N/m2
poissons ratio= .3
density= 7830kg/m3
first performing modal analysis with just arresting displacements in 1 side in subspace method and getting 10 sets of frequencies..
then performing transient dynamic analysis in mode superposition method with dynamic loads.and solve it
contact me at
shrikant.zarekar [at] iitb.ac.in /
shrikantzarekar [at] me.iitb.ac.in
Have attached my resume.
Thank you.
I am a second year undergraduate student of IIT Bombay (www.iitb.ac.in).In the coming summer, we are supposed to undertake an internship with an industrial establishment or a research lab of repute, in or out of India.
NANOSHEL makes more than 50 types of products, among which the main products are nanotubes, SWCNT´s, MWCNT´s, nanoparticles,. These products are widely used in the fields such as textile industry, ceramics, chemical fiber, plastics, coatings, cosmetics, rubber, electrical and electronic equipments, electric power generation and boiler and so on.