Mechanics of wrinkle/ridge transitions in thin film/substrate systems
Mechanics of wrinkle/ridge transitions in thin film/substrate systems
Lihua Jin, Atsushi Takei, JohnW.Hutchinson
Mechanics of wrinkle/ridge transitions in thin film/substrate systems
Lihua Jin, Atsushi Takei, JohnW.Hutchinson
To improve further computational tools for fracture, we need a
talented phd. We are developping transition models from damage
to fracture for several type of materials (quasi-brittle and ductile).
The position will be open until filled. Please send me your CV
if you are interested.
The theoretical framework is the Thick Level Set model for damage (TLS)
and the numerical implementation uses level sets and the extended
finite element method (X-FEM).
The research team currently gathers 9 persons.
Computational Biomechanics for Medicine X (http://cbm.mech.uwa.edu.au/) will be held in Munich, Germany, on 5 October 2015, in conjunction with MICCAI 2015 (http://www.miccai2015.org/).
Dear colleagues and friends,
Please consider to contribute a talk at the symposium of “Mechanics of Instability and Interfacial Adhesion in Bio-Compatible Electronics”, organized for the 52nd Annual Technical Meeting of the Society of Engineering Science (SES). The SES 2015 meeting will be held at Texas A&M University, Oct 26-28, 2015. Abstracts are due Jun 26, 2015.
The Graduate School -1483 of the German Research Foundation (DFG) “Process Chains in Production - Interaction, Modeling and Assessment of Process Zones” at the Karlsruhe Institute of Technology (KIT) and Karlsruhe University of Applied Sciences invite applications for a PhD candidate position (Salary scale TV-L E13).
The Computational Physics Group at the Aerospace and Mechanical Engineering Department at the University of Notre Dame is seeking a highly qualified candidate for the post-doctoral associate position in Computational Science and Engineering. The successful candidates will be a key part of a team that is developing and implementing adaptive, multiscale, high-performance (parallel) computational algorithms for numerical solutions of chemo-thermo-mechanical PDE’s with emphasis on complex heterogeneous materials, such as heterogeneous reactive composites, etc.
Dear colleague,
We encourage you to submit an abstract to the symposium "Multi-scale Mechanics of Particulate Media" within the "Mechanics of Soft Materials" focus area of the 52nd Technical Meeting of the Society of Engineering Science (SES) to be held at Texas A&M University, October 26-28, 2015. The symposium description may be found below. For further details and to submit and abstract, see the meeting website: http://ses-2015.org/. The symposium may be found under Focus Area III. The submission deadline is June 26, 2015.
Dear Colleagues,
We would like to invite you to submit an abstract to the Symposium on "Mechanics and Characterization of Micro/nanoporous Materials and Applications in Energy and Environments" at the 2015 SES meeting to be held at Texas A&M University in College Station, Texas, October 25-28, 2015.
Topics of interest include, but are not limited to:
--Mechanics and design of micro/nanoporous materials
--Interface mechanics of functionalized micro/nanoporous materials
--Micro/nanoporous materials for energy storage and environmental purification
Dear Colleagues:
Please, consider to attend the symposium entitled "Computational Materials with Emphasis on Phase Transformation" organized for the occasion of the 52nd Annual Technical Meeting of the Society of Engineering Science (SES). The SES meeting will be held at Texas A&M University, October 26 - 28, 2015 (http://ses-2015.org/).
The outmost surface of engineering materials typically faces the most severe risk of damage. When such boundary conditions are given, employment of graded structures is desired to enhance the safety of the structure in an economic way [1]. Mechanically, adopted gradient structures typically involves change in Young’s modulus or strength, and are beneficial to crack shielding, reducing stress concentration, retarding shear localization, etc.