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Postdoctoral Position in Mechanics of Soft Materials/Flexible Electronics/Adhesion
A postdoctoral position is available starting immediately in the Johnson Research Group at the University of Illinois at Urbana-Champaign. The position will involve theoretical and computational modeling of the mechanics of soft materials/flexible electronics/adhesion, with applications in photonics and energy storage. The work will involve significant interactions with experimental groups in the Department of Materials Science at the University of Illinois. Applicants should send a CV with a list of references to htj@illinois.edu.
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For Postdoctoral Position in Mechanics of Soft Materials
Respected Sir(Prof. Harley T. Johnson):
I am Hemaraju Pollayi pursuing PhD(Expected Graduation Date:
August 2010) at Aerospace Engineering, Indian Institute of
Science-Bangalore and working with Dr. Dineshkumar Harursampath(PhD,
Georgia Tech).
Could You please tell me if You have any position available for a post-doctoral research fellowship ?
I am very happy if You take Me as a post-doctoral research fellow.
I have forwarded My CV to Your E-mail: htj@illinois.edu
Thanking You Sir
Yours Sincerely,
raju.
Regards
================
Hemaraju Pollayi
Graduate Student(PhD Scholar)
Thesis Advisor: Dr. Dineshkumar Harursampath(PhD, GeorgiaTech)
Founder-Director of NMCAD Lab
Nonlinear Multifunctional Composites Analysis and Design Lab(NMCAD Lab)
AR&DB Centre of Excellence in Composites Structures Technology(ACECOST)
Department of Aerospace Engineering
Indian Institute of Science
Bangalore - 560012, Karnataka, INDIA
E-Mail: pollayi_hemaraju@yahoo.com
pollayi.hemaraju@gmail.com