SES 2011, Minisymposium on Mechanics of Adhesion

Adhesion has long been an important issue for mechanics and many other disciplines. Its influence spans macro-, micro-, nano- and molecular scales. When size goes down, adhesion plays a more and more significant role. Many important technologies attribute to adhesion, such as transfer printing for advanced microfabrication,  super adhesives inspired by gecko foot hairs, and self-assembly. Adhesion also has strong implications on the behavior of nanomaterials (such as nanotubes and graphenes) and biological system (such as cells). This minisymposium "Mechanics of Adhesion" is to provide a forum of discussion and communication, for researchers working on and interested in adhesion related subjects.

We sincerely invite you to submit abstracts to this upcoming 48th Annual Technical Meeting of Society of Engineering Sciences (SES 2011), to be held at Northwestern University in Evanston, Illinois, on October 12-14, 2011.

Abstracts can be submitted through http://ses2011.org/submit_abstracts.php.
"Mechanics of Adhesion" minisymposium is labeled 5.5. The deadline for abstract submission is June 1.  

Look forward to seeing you!

Organizer: Jianliang Xiao (jianliangxiao2010@u.northwestern.edu)