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Symposium: "Characterization and Imaging of Structural and Material Imperfections", SES 50th Meeting, Brown University

stefanogonella's picture

Dear colleagues,


We would like to bring to your attention the symposium:



that we are organizing at the SES 50th Annual Technical Meeting/ASME-AMD Summer Meeting to be held at Brown University in Providence, RI during July 28-31, 2013.

This symposium will be an occasion to bring together people of different backgrounds for a summit on structural and material imaging and characterization, with contributions that couple traditional mechanics-based approaches with recent developments in data mining and machine learning. Contributions are seeked from all areas of engineering and science, including, but not limited to, mechanics, structural engineering, materials science, medicine and geophysics

We are majorly interested in the following areas:

-          Anomaly detection at different scales (from MEMS to large civil structures) of homogeneous and heterogeneous             (microstructured, porous, etc.) media.

-          Non-destructive inspection techniques for thin structures, such as guided-waves ultrasonics.

-          Online baseline-free structural health monitoring techniques.

-          Inverse problems for defect reconstruction and structural identification based on remote sensing of the operational response.

-          Distributed detection and decision making of structural events through data mining and machine learning approaches.

-          Supervised and unsupervised learning techniques for system characterization

-          Medical imaging and techniques for detection of abnormalities in biological tissues.

-          Design of structures based on the exploitation of inclusions and defects.

More information on the symposium and a link to submit an abstract is available here:

The deadline for submitting an abstract is April 1, 2013.

This year is the 50th anniversary of SES, and so the meeting is expected to be particularly memorable. We hope that you will be able to join us.

Best Regards,


Maria Chierichetti and Stefano Gonella

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