Call for abstracts: SES symposium on "Soft Materials"

Dear Colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science will be hosted  by the University of Maryland (UMD) during 2-5 October 2016 (note the new conference date). As part of this meeting, we are organizing a symposium to address recent experimental, computational, theoretical, and manufacturing advances on the mechanics and physics of soft materials. Topics of particular interest include:

• Electroactive and magnetoactive elastomers
• Hydrogels and soft wet materials
• Liquid crystal elastomers
• Shape-memory and light-sensitive polymers
• Ionic Polymer-Metal Composites (IPMC)
• Microstructural instabilities, fracture, and adhesion
• Soft biological materials and Bioinspired Materials
• Multiphysics phenomena in Soft Materials
• 3D/4D printing and fabrication of soft materials

We are writing to invite you to present your work in this symposium. To submit an abstract, please visit the conference website or abstract submission website and choose

Symposium C-6: Mechanics and Physics of Soft Materials

There will also be other symposia on related topics (http://ses2016.org/tracks-symposia/). The deadline for abstract submission is June 15, 2016.

We look forward to your participation.

Stephan Rudykh, Technion - Israel Institute of Technology

Yuhang Hu, University of Illinois Urbana-Champaign

Oscar Lopez-Pamies, University of Illinois Urbana-Champaign

Xuanhe Zhao, Massachusetts Institute of Technology