Dear Colleagues,
Please consider submitting abstract(s) to Symposium D-11 "Instability and Interfacial Adhesions in Bio-Compatible Electronics" at the 2016 SES meeting to be held at the University of Maryland-College Park During October 2-5, 2016. Abstract due: June 15, 2016.
Topics of interest include:
(1) Mechanics and instability in hard-soft integrated systems
(2) Adhesion and fracture at heterogeneous interfaces
This symposium aims to offer a forum to foster discussions on the latest mechanics advances in the instability and interfacial adhesion in heterogeneous, integrated micro-structures and their applications in bio-compatible electronics. Soft electronics, including flexible, stretchable, and bio-integrated and bio-mimicking electronic systems, have enabled novel and promising designs for display, energy, and therapeutic and diagnostic medical applications. An important objective of this symposium is to forge interactions among active researchers from applied mechanics, chemical engineering, materials science & engineering, and electrical engineering so that collaborative contributions can be made to this highly interdisciplinary topic.
We look forward to your submission!
Best regards,
Organizers:
Shuodao Wang, Oklahoma State University
Huanyu Cheng, Pennsylvania State University
Jianling Xiao, University of Colorado at Boulder