The product process department in Huawei Technology in Shenzhen, China is expanding our simulation capability. We are looking for interested simulation/mechanical engineers, preferably experiences in solder fatigue and high strain rate scenarios in board level electronic packaging. If anyone is interested, please sent me your resume via koh.sau.wee [at] huawei.com (koh[dot]sau[dot]wee[at]huawei[dot]com)
Regards
Sau