Dear Colleagues:
The 14th U.S. National Congress on Computational Mechanics (USNCCM14) will be held at the Palais des Congrès de Montréal, QC, Canada, July 17-20, 2017 (http://14.usnccm.org/).
As a part of this meeting, we are organizing a mini-symposium to address recent advances in Modeling Materials with Coupled Physics (http://14.usnccm.org/MS709). Topics of particular interest include (but not limited to)
- Electroactive and magnetoactive materials
- Shape-memory and light-sensitive polymers
- Design of microstructured and functional materials
- 3D printing and additive manufacturing
- Computational homogenization and multiscale modeling
- Design and modeling of metamaterials
We cordially invite you to submit your abstract for this mini-symposium. To submit an abstract, please visit the conference website http://14.usnccm.org/abstract_instructions .
The deadline for abstract submission is February 28, 2017.
We are looking forward to your presentations at this mini-symposium.
With our best regards,
Stephan Rudykh, Technion – Israel Institute of Technology
Sergey Kuznetsov, North Carolina State University