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Apple Hiring Hardware FEA Engineer, Internship Position


I am from Apple Hardware Engineering Team, responsible for FEA simulation and related material testing. Our team has one internship position open, starting by the end of 2020. See the attached job description for details. We prefer last year PhD Student.


If you are interested, please send your resume to Thank you. 




- The ideal candidate will have 3+ years of experience in advanced FEA (Finite Element Analysis) in high volume consumer electronic products and/or modules. 

- ANSYS or Abaqus experience required. Non-linear FEA experience desirable. APDL experience, LS-DYNA experience is plus.

- Applied knowledge/experience with engineering mechanics, material science and basic chemistry. 

- Experienced with material modeling (visco-elasticity, visco-plasticity) and standard test procedure for model calibration/validation. 

- Excellent written and verbal communication skills.

- Ability to interact with management, team members and external vendors. The candidate must be able to efficiently collaborate with team members to achieve project goals. 




Drive analysis of cutting edge designs, enabling early material, process and structural design optimization as well as root cause and failure analysis of difficult mechanical problems. 

Generate FEA/analytical models of mechanical parts, modules, and assemblies. Perform static, dynamic, structural, and thermal-mechanical analysis. 

Own and drive material characterization and testing plan to support modeling efforts. 

Communicate and report analysis results to team as well as cross-functional peers and management on a regular basis. 



- Last year PhD candidate preferred

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