Call for abstracts: Topic on 3D Printed Soft Materials in ASME IMECE 2021 (virtual conference)

Dear colleagues:

We would like to invite you to submit an abstract to the topic on 3D Printed Soft Materials at the 2021 ASME IMECE, which is to be held as a virtual conference online from November 1 to November 5, 2021. This year, we are more than happy to invite Dr. Cheng Sun from Northwestern University to give an invited talk.

Please refer to the attached file for the scope of our topic. To submit an abstract, please

1. Go to: https://event.asme.org/IMECE

2. Select Track 12 (Mechanics of Solids, Structures and Fluids)

3. Select Topic 12-14 (3D Printed Soft Materials)

The deadline for abstract submission (presentation only) is July 09, 2021.

Should you have any questions, please feel free to contact us. The topic organizers would greatly appreciate it if you could pass this information to your students, postdocs, and colleagues. We look forward to receiving your contributions!

Topic Organizers 

Kai Yu, Assistant Professor, University of Colorado Denver <kai.2.yu@ucdenver.edu> 

Sung Hoon Kang, Assistant Professor, Johns Hopkins University <shkang@jhu.edu> 

Howon Lee, Associate Professor, Seoul National University <howon.lee@snu.ac.kr> 

Qiming Wang, Assistant Professor, University of Southern California <qimingw@usc.edu> 

Jordan R. Raney, Assistant Professor, University of Pennsylvania <raney@seas.upenn.edu>