11th International Workshop on Stress-Induced Phenomena in Metallization
April 12 - 14, 2010 in Dresden, Germany
The workshop will provide a forum for presenting current research and
for discussions on issues related to stress-induced phenomena in
on-chip metal interconnects and solder joints. Stresses arising in
metal structures and surrounding dielectric materials due to novel
process steps, thermal mismatch of thin film materials,
electromigration or microstructure changes can lead to degradation and
failure of microelectronic products.
Please see attachment for Call-for-Papers.
| Attachment | Size |
|---|---|
| stress_workshop_2010_2nd_announcement.pdf | 88.37 KB |