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FEA Improves Reliability of Flip-Chip Packaging

On Aug 10, 2009, Semiconductor International (SI) Newsbreak published a report on my work in AMD about 3D fracture study of underfill delamination as the top story in that issue.  I have never imagined that. Except the pleasure I received from this good news, I wonder if this work is also interesting to iMechanica community.  For that reason, I attach here the SI news report and the original paper published on ITherm2008 Proceedings. Welcome any comments and thoughts.

 

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