Additive manufacturing of ceramics from preceramic polymers
Following extensive research by our outstanding doctoral candidate here, Dr. Wang, a publication in the journal Additive Manufacturing is now in press.
The fabrication process for microelectronic devices can have over 300 different processing steps and can take anywhere from six to eight weeks. During this process the wafer substrate must be able to withstand the extreme conditions of manufacturing, since a failure at any step would result in the loss of time and money. The hardness and strength of a wafer must be much greater then the conditions imposed during manufacturing to insure a failure will not occur. Here nanoindnetation is used.
