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Nanoindentation of Silicon Carbide Wafer Coatings

The fabrication process for microelectronic devices can have over 300 different processing steps and can take anywhere from six to eight weeks. During this process the wafer substrate must be able to withstand the extreme conditions of manufacturing, since a failure at any step would result in the loss of time and money. The hardness and strength of a wafer must be much greater then the conditions imposed during manufacturing to insure a failure will not occur.

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