conference

Civil Engineering Conference in the Asian Region and Australasian Structural Engineering Conference 2010

The 5^th International Civil Engineering Conference (CECAR5) hosted by Engineers Australia, together with the Australasian Structural Engineering Conference (ASEC 2010) will bring together a broad cross-section of the civil and structural engineering professions who want to learn, network and advance their technical skills.

This workshop is being organized under the auspices of the International Federation for the Promotion of Mechanism and Machine Science (IFToMM).

Topics of interest include: Microactuators, Microsensors, Micro-opto-mechanical devices, Mechanical Tools for cell and tissue studies, Micromanipulation, Micro-assembly, Microscale flight and swimming, Surgical tools, Micro-robotics, Micro-scale power generation, and Miniature manufacturing machines.

Please consult the Call for Papers (attached) for further details.

The 2009 ASME Congress starts this weekend.  You can find the schedule of the meetings of all the committees (326KB pdf).  This note lists a few special events. 

Monday, 16 November, 8:00 am to 9:30 am. Plenary Session in Mechanics of Solids, Structures and Fluids

The 20^th International Workshop on Computational Mechanics of Materials (IWCMM 2010) will be held on 8-10 September 2010 at Loughborough University, UK. Selected papers will be published in a Special Issue of Computational Materials Science by Elsevier.

For details see iwcmm.lboro.ac.uk .

Topics:

ICEM 14 - International Conference on Experimental Mechanics

Poitiers, France, 4 - 9 July 2010

Abstracts are invited for the Smart Materials and Systems Mini Symposium (A9). We will welcome works related to smart materials and multifunctional nanocomposites and nanostructures characterisation and testing. More information can be found at the Conference website: http://www.icem14.fr

11th International Workshop on Stress-Induced Phenomena in Metallization

April 12 - 14, 2010 in Dresden, Germany

The workshop will provide a forum for presenting current research and
for discussions on issues related to stress-induced phenomena in
on-chip metal interconnects and solder joints. Stresses arising in
metal structures and surrounding dielectric materials due to novel
process steps, thermal mismatch of thin film materials,

Gordon Conference 2010Thin Film & Small Scale Mechanical Behavior

July 25-30, 2010, Colby College, Waterville, ME

Chair: Oliver Kraft (oliver.kraft [at] kit.edu), Vice Chair: John Balk

Are you curious to learn more about FEA or CFD simulations on patient-specific data? Then Materialise and ANSYS would like to invite you to their upcoming free seminar on “Virtual Prototyping Breakthroughs for Innovative Healthcare Applications”, where you will learn how numerical solutions can help the Biomedical and Healthcare industry in the development of innovative solutions.



Practical Info

- Date: Friday, November 20th, 2009.

- Cost: FREE!

- Location: Leuven (Belgium), Materialise HQ office

Dear Colleagues,



We like to draw your attention to the mini-symposium



MS6043 - Computational Mechanics of Electro-Active Materials



organized by Prof. Ellen Kuhl, Prof. Andreas Menzel and myself in the

WCCM IX. The abstract outlining the objectives of this integrative

mini-symposium is enclosed to this post as plain text and also as a

pdf-attachment.



The 9th World Congress on Computational Mechanics (www.wccm2010.com)