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Arbitrary Lagrangian Eulerian modeling in large strain solid mechanics problems

Submitted by Wei Wang on
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I am interested in Arbitrary Lagrangian Eulerian formulation in modeling large strain solid mechanics problems. Can any one recommend some good resource on this topic? Both theoretical and numerical implementation are desired. Thanks in advance.

Deformation of FCC Nanowires by Twinning and Slip

Submitted by Harold S. Park on

We present atomistic simulations of the tensile and compressive loading of single crystal FCC nanowires with <100> and <110> orientations to study the propensity of the nanowires to deform via twinning or slip.  By studying the deformation characteristics of three FCC materials with disparate stacking fault energies (gold, copper and nickel), we find that the deformation mechanisms in

A subdomain collocation method based on Voronoi domain partition and reproducing kernel approximation

Submitted by Jinxiong Zhou on

A subdomain collocation method based on Voronoi diagrams and reproducing kernel approximation is presented. The unkonwn field variables are approximated via reproducing kernel approximation. The body integration arising from the numerical evaluation of Galerkin weak form is converted into much cheaper contour integration along the boundary of each Voronoi cell. The Voronoi cells also provide an natural structure to perform h-adaptivity.

A short paper on T-stress of an interfacial crack in a bi-material strip

Submitted by Jae-Hyun Kim on

The attached file is on T-stress of an interfacial crack in a bi-material strip. The geometry of the problem is the same with that of Suo and Hutchinson (1990, IJF). Using a conservation integral technique, a formula for T-stress is derived with two numerical factors.

Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer

Submitted by Ephraim Suhir on

An approximate predictive model is developed for the evaluation of the interfacial thermal stresses in a soldered bi-material assembly with a low-yield-stress bonding material. This material is considered linearly elastic at the strain level below the yield point and ideally plastic at the higher strains. The results of the analysis can be used for the assessment of the thermally induced stresses

On the thermomechanical coupling of shape memory alloys and shape memory alloys composites

Submitted by Yuval Freed on

Smart materials have received much attention in recent years, especially due to their various applications in smart structures, medical devices, actuators, space and aeronautics. Among these
materials, shape memory alloys exhibit extremely large, inelastic, recoverable strains (of the order of 10%), resulting from transformation between austenitic and martensitic phases. This
transformation may be induced by a change, either in the applied stress, the temperature, or both.

Modeling Surface Stress Effects on Nanomaterials

Submitted by Harold S. Park on

We present a surface Cauchy-Born approach to modeling FCC metals with nanometer scale dimensions for which surface stresses contribute significantly to the overall mechanical response. The model is based on an extension of the traditional Cauchy-Born theory in which a surface energy term that is obtained from the underlying crystal structure and governing interatomic potential is used to augment the bulk energy.