research
Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer
An approximate predictive model is developed for the evaluation of the interfacial thermal stresses in a soldered bi-material assembly with a low-yield-stress bonding material. This material is considered linearly elastic at the strain level below the yield point and ideally plastic at the higher strains. The results of the analysis can be used for the assessment of the thermally induced stresses
On the thermomechanical coupling of shape memory alloys and shape memory alloys composites
Smart materials have received much attention in recent years, especially due to their various applications in smart structures, medical devices, actuators, space and aeronautics. Among these
materials, shape memory alloys exhibit extremely large, inelastic, recoverable strains (of the order of 10%), resulting from transformation between austenitic and martensitic phases. This
transformation may be induced by a change, either in the applied stress, the temperature, or both.
Adaptation of arteries to pressure changes
Arteries are living organs that can remodel themself in response to stress changes. Arterial remodeling is a big topic and this paper shows only a tip of the iceberg.
Modeling Surface Stress Effects on Nanomaterials
We present a surface Cauchy-Born approach to modeling FCC metals with nanometer scale dimensions for which surface stresses contribute significantly to the overall mechanical response. The model is based on an extension of the traditional Cauchy-Born theory in which a surface energy term that is obtained from the underlying crystal structure and governing interatomic potential is used to augment the bulk energy.
rupture of Cu films
Dear Prof. Li, i have made two figures about rupture strains of films on elastomer according to the datas shown in your papers-- "Deformability of thin metal films on elastomer substrates" International Journal of Solids and Structures 43 (2006) 2351–2363. and "Stretchability of thin metal films on elastomer substrates" APL85(2004). According to the papers, the stiffer or thicker the elastomer substrates, the larger rupture strains, then where would be the curve with H/h =200? Whether the rupture strain is even large, according to your simulations?
Blood Clot Mechanics at the Molecular Level
Cross-posted to Biocurious a blog about biology through the eyes of physicists.
Solution of system of Differential equations
Dear Wei and Mogadalai,
As mentioned earlier I am trying to solve for a vector {x} from
{x'}=[A(t)]{x}
where [A(t)] is known matrix of size (2X2) at the max 4x4, elements and are functions of "t".
{x} is a vector (nX1) function of 't'
{x'} is derivative of {x} with respect to 't'.
Analytical derivation on the stress of the adhesive layer based on beam/plate therories?
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I just came across the lecture notes from Professor Nix on Mechanical Properties of Thin Films. It is very educative and helpful. I wonder if anyone could recommend some analytical derivation on the stress of the adhesive layer between two similar/dissimilar adherends (sandwiched specimen) under mechanical or thermal loading.
Many thanks ...
Phase field simulations of polarization switching-induced toughening in ferroelectric ceramics
Polarization switching-induced shielding or anti-shielding of an electrically permeable crack in a mono-domain ferroelectric material with the original polarization direction perpendicular to the crack is simulated by a phase field model based on the time-dependent Ginzburg-Landau equation. The domain wall energy and the long-range mechanical and electrical interactions between polarizations are taken into account. The phase field simulations exhibit a wing-shape- switched zone backwards the crack tip.