ENME 808H

My name is Hongbo Bi and I am a Ph.D candidate in Mechanical Engineering under Dr. Bongtae Han at the University of Maryland, College Park. I recieved Master of Science (M.S.) degree in Mechanical Engineering from University of Maryland, College Park and and Bachelor of Engineering (B.E.) in Automatic Control from University of Science and Technology of China. I am currently entrolled into class of Flexible Macroelectronics (ENME808H) at the University of Maryland, which is taught by Prof. Teng Li.

My name is Daniel Kodan, I am an undergraduate Mechanical Engineering student at the University of Maryland.  I am currently taking a flexible macroelectronics class taught by Dr. Teng Li.  I am

Hi my name is Gary Palmer II and I'm a senior mechanical engineering major at the University of Maryland. My interest in flexible macroelectronics stems from its future capabilities. The fact that these components can be integrated with everyday objects is fascinating. Since this technology will be used in the future, it will be great to be on the leading edge of its development.

My name is Matthias Irmscher and I am a graduate student currently visiting the University of Maryland for a year. I will finish my equivalent of a Master's degree at the Technical University of Ilmenau in Germany by the end of 2008. I am a current Fulbright grantee.

Dear All,

My name is Ravikumar Sanapala. I am doing Master of Science (M.S) in Mechanical Engineering at University of Maryland. I recieved a Bachelor of Technology (B.Tech) degree in Mechanical Engineering from Indian Institute of Technology (IIT) Madras, India.

 My name is Mohamed Nefatni. I'm a senior in Mechanical Engineering, expecting to graduate in December 2007. I was born in Tunisia (North Africa) and came to the U.S 4 years ago. I'm a transfer student from Montgomery College. I'm actually planning to apply for graduate school and my research interests are Electronic packaging and Reliability.

I am a PhD student in Mechanical Engineering. My research field is the reliability of electronics and packaging. These topics have a big relationship with the manfacturing process of the electronics.