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Journal Club Theme of March 15: Impact of Chip-Package Interaction on Reliability of Copper/Low k Interconnects and Beyond |
Rui Huang |
10 months ago |
| Forum topic |
Texas Instruments will extend outsourcing model. Will more people lose jobs? |
Zhigang Suo |
10 months ago |
| Blog entry |
Harvard Task Force Calls for New Focus on Teaching and Not Just Research |
Zhigang Suo |
10 months ago |
| Blog entry |
IBM Airgap Microprocessors enabled by self assembly (Video) |
Teng Li |
10 months ago |
| Blog entry |
research opportunities, join us! |
Henry Tan |
10 months ago |
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Innovation and Integration in the Changing Global Higher Education Landscape |
SHIH Choon Fong |
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Mechanical Properties of Thin Films (class notes for a graduate class at Stanford University) |
William D. Nix |
10 months ago |
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Delamination in Patterned Films |
Xiao Hu Liu |
10 months ago |
| Forum topic |
low-temperature load cell |
Ting Tsui |
10 months ago |
| Blog entry |
Ph.D. Candidate Position at the University of Waterloo |
Ting Tsui |
10 months ago |
| Blog entry |
Ph.D. Candidate Position Available at the University of Waterloo |
Ting Tsui |
10 months ago |
| Blog entry |
Constraint Effects on Thin Film Channel Cracking Behavior |
Ting Tsui |
10 months ago |
| Blog entry |
Experimental determination of crack driving forces in integrated structures |
Zhigang Suo |
10 months ago |
| Blog entry |
State-of-the-art understanding of cracking for porous materials? |
Al Zappor |
19 years 2 months ago |