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ASME 2015 International Technical Conference and Exhibition on Packaging (InterPACK 2015) July 6-9, 2015 The Fairmont San Francisco Hotel, San Francisco, California |
Xiao Hu Liu |
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iMechanica has just upgraded to Drupal 5. Any issues? |
Zhigang Suo |
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Delamination in Patterned Films |
Xiao Hu Liu |
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Giant Piezoresistive On/Off Ratios in Rare-Earth Chalcogenide Thin Films Enabling Nanomechanical Switching |
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CFD analyst opening |
Xiao Hu Liu |
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Position for expert FEA analyst available at Dallas area, Texas |
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Job Opening at IBM Microelectronics: Semiconductor Process Integration Engineering Professinal |
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Packaging Mechanical Engineer at Hopewell Junction, NY, IBM Microelectronics Division |
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Open Position: 2011 Summer Internship at IBM TJ Watson Research Center, Yorktown Heights, NY |
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A method to analyze dislocation injection from sharp features in strained silicon structures |
Zhen Zhang |
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Pattern Effect on Low-k Channel Cracking |
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What is Grid Computing? How can it be important to mechanicians? When? |
Zhigang Suo |
18 years 11 months ago |