| Blog entry |
Effect of Residual stresses on the Interfacial Fracture Toughness of polymer/Metal Interface |
shirangi |
4 weeks ago |
| Blog entry |
Chip-package interaction and interfacial delamination |
Zhen Zhang |
4 weeks ago |
| Blog entry |
Virtual Testing of Structural Integrity in Microelectronic Assemblies |
shirangi |
4 weeks ago |
| Blog entry |
Mechanism of Moisture Diffusion and Adhesion Degradation in Epoxy Molding Compounds |
shirangi |
4 weeks ago |
| Blog entry |
EuroSimE 2008 in Freiburg, Germany |
shirangi |
4 weeks ago |
| Blog entry |
International conference in Microreliability and Nanoreliability, Berlin, Sep. 2007 |
shirangi |
4 weeks ago |
| Blog entry |
Interfacial moisture diffusion using cohesive zone elements |
shirangi |
4 weeks ago |
| Blog entry |
Grant for master thesis at Bosch: FEM Simulation of Fracture in Electronic Components |
shirangi |
13 years ago |