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Grant for master thesis at Bosch: FEM Simulation of Fracture in Electronic Components

Submitted by shirangi on

If you are a master student and would like
to do your master thesis, there is an opportunity to do it at Bosch in
Stuttgart, Germany. The grant will be given for 6 months and can be extended to
6 more months ( 6 months internship plus six months master thesis.)

For more information regarding the grant and
the position please see below job description or contact me.

Regards,

Hossein  

Job description: 

Effect of Residual stresses on the Interfacial Fracture Toughness of polymer/Metal Interface

Submitted by shirangi on

When a bi-material sample for the characterization of interfacial fracture toughness is manufactured, the sample is not usually stress-free at room temperature. If an interface between a metallic substrate and a polymeric adhesive is considered, there are essentially two sources of residual stresses for a dry sample at room temperature:

1-    The mismatch between the Coefficient of Thermal Expansion (CTE) of adhesive and substrate induces a concave or convex warpage, depending on the CTE values of the two materials.

EuroSimE 2008 in Freiburg, Germany

Submitted by shirangi on

 

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 

EuroSimE 2008 Will be held in Konzerthaus, downtown Freiburg, on April 20, 2008 (courses), April 21-22-23 (conference, exhibition).

http://www.eurosime.org/

 program also available:

http://www.eurosime.org/prog.htm

Interfacial moisture diffusion using cohesive zone elements

Submitted by shirangi on

Hello every body,

As most of you know, fracture mechanics of polymer materials needs a special consideration of the viscoelastic material properties. Especially under thermomechanical loading the role of glass transition temperature T_g is very important. That is why people try to characterize the material with different methods including stress relaxation based on Time-Temperature superposition or DMA test.