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shirangi's picture

Grant for master thesis at Bosch: FEM Simulation of Fracture in Electronic Components

If you are a master student and would like
to do your master thesis, there is an opportunity to do it at Bosch in
Stuttgart, Germany. The grant will be given for 6 months and can be extended to
6 more months ( 6 months internship plus six months master thesis.)

For more information regarding the grant and
the position please see below job description or contact me.



Job description: 

Rui Huang's picture

Journal Club Theme of March 15: Impact of Chip-Package Interaction on Reliability of Copper/Low k Interconnects and Beyond

Choose a channel featured in the header of iMechanica: 

The exponential growth in integrated device density has yielded high-performance microprocessors containing almost 1 billion transistors per chip for the current 65 nm technology. Continuous scaling of the devices and performance requires innovations in materials, processes, and designs for both back-end-of-line (BEoL) interconnects and packaging structures. Mechanical reliability has been a limiting factor for implementation of new materials and processes.

Rui Huang's picture

Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films

H. Mei, Y. Pang, and R. Huang, International Journal of Fracture 148, 331-342 (2007).

Following a previous effort published in MRS Proceedings, we wrote a journal article of the same title, with more numerical results. While the main conclusions stay the same, a few subtle points are noted in this paper.

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