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Fifth Biennial Workshop on Direct Methods

The fifth biennial workshop on 'Direct Methods' will be held in Oxford, UK on 6th to 8th September 2015.  It follows on from previous successful workshops held in Aachen, Lille, Athens and Reggio Calabria (see http://www.iadime.unirc.it/ ).

Fifth biennial workshop on Direct Methods

The fifth biennial workshop on 'Direct Methods' will be held in Oxford, UK on 6th to 8th September 2015.  It follows on from previous successful workshops held in Aachen, Lille, Athens and Reggio Calabria (see http://www.iadime.unirc.it/ ).

University Lectureship in Solid Mechanics/Materials Engineering, University of Oxford

The Department of Engineering and St Hugh's College at Oxford University
have a University Lectureship available in the area of Solid Mechanics
and Materials Engineering.  The closing
date for applications is 31st May 2012.  Further information can be
found in the attached files.

We look forward to receiving your application.

Alan Cocks

Postdoctoral Research Assistant in Modelling Creep Damage

At Oxford University we are seeking to appoint a post doctoral Research Assistant to work on the modelling of cavity nucleation and growth in the heat affected zone of a welded component operating in the creep regime. A detailed advertisement and further particulars about the post can be found in the attached files.

Further Information can be obtained from Prof Alan Cocks - alan.cocks@eng.ox.ac.uk

University Lectureship in Solid Mechanics and Materials Engineering, University of Oxford

The Department of Engineering and Balliol College at Oxford University have a University Lectureship available in the area of Solid Mechanics and Materials Engineering.  We would  be particularly interested in receiving applications in the general area of composite and lightweight materials, including, polymer, metal, ceramic, biological and multifunctional composites, foams and lattice materials. The closing date for applications is 16th January 2012.  Further information can be found in the attached files.

We look forward to receiving your application.

Alan Cocks

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