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EM 388F Term Paper: Subcritical Cracking of Low-k Dielectrics

Submitted by hualiang shi on
fracture mechanics
University of Texas at Austin
term paper
EM 388F
Spring 2008
DCB
low-k dielectrics
subcritical cracking
FPB
first principle calculation

Abstract

 

With the scaling of VLSI, ultra low-k dielectrics with porosity are being introduced to reduce the capacitance coupling. But due to the weak bonding strengths, low-k dielectrics may fail by environmental-assisted subcritical cracking, fracture at stresses far below the loads required for catastrophic failure, causing reliability issues. In this term paper, several references are reviewed to investigate the mechanism of subcritical cracking at multiscale levels.

 

About ABAQUS UMAT

Submitted by rrahman on
research

Hi

I am working on probailistic modeling of damages in composite materials. I have my own developed mathematical model for calculating damage probability. Now I am trying to use this model in ABAQUS to see the effect of damages with a certain probability. Please kindly let me know if there is any reference code or tutorial for UMAT where I can apply the damages with different probabilities.

Thanks in Advance

 

Rezwanur Rahman

The University of Alabama

USA 

The effect of porosity on the stiffness and fracture energy of brittle organosilicates

Submitted by Li Han on
thin film
fracture
Porous low-k
elastic property

Integrating porous low-permittivity dielectrics into Cu metallization is one of the strategies to reduce power consumption, signal propagation delays, and crosstalk between interconnects for the next generation of integrated circuits. However, the porosity and pore structure of these low-k dielectric materials also strongly affects other important material properties besides their dielectric constant.

"Experimental Multi-Scale Mechanics" Symposium for SES 2008

Submitted by Sam Daly on
conference
Conference
SES

A symposium on Experimental Multi-Scale Mechanics is being organized for the 2008 SES conference at the University of Illinois at Urbana-Champaign from October 12th through October 15th. The conference website is located at http://ses2008.mechse.uiuc.edu/

To submit abstracts to this symposium please use the abstract submission form and select the symposium title. The deadline for abstract submissions is April 30, 2008.

iMechanica back on service

Submitted by Teng Li on
iMechanica

Dear fellow iMechanicians:

After some technical problems over the past weekend, iMechanica is now back on full service. We apologize for any inconvenience this may cause and thank for your patience.

We are particularly grateful to Ms. Lesley Lam in OIT of Harvard School of Engineering and Applied Sciences for her prompt fix of the problem.

 

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