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It gives me great pleasure to announce the outcome of the 2015 competition for the Eshelby Mechanics Award for Young Faculty. This award is given annually to rapidly emerging junior faculty who exemplify the creative use and development of mechanics. The intent of the award is to promote the field of mechanics, especially among young researchers. The selection committee consisted of: K. Ravi-chandar (UT Austin), Huajian Gao (Brown University), G. Ravichandran (Caltech), Roger Fosdick (Minnesota University), and Yonggang Huang (Northwestern University).

We are looking for a highly motivated individual with a strong background in materials science and mechanics, to sudy dynamic shear failure of metallic materials. Experience with numerical modeling required. Previous exposure to experimental work will be considered as an advantage.

Additional information can be found in the atatched description of the planned research.

Contact email:  merittel [at] technion.ac.il

Polymer–metal–polymer composite films are widely used in packaging, building, and cooling, and more recently as envelopes for pouch lithium-ion batteries (LIBs). The influences of heat seal temperature and dwell time on the heat seal strength (HSS) of five different multilayer films were investigated by T-peel testing. The failure modes were observed and analyzed by digital optical microscopy. Heat-sealing temperature and dwell time interacted and simultaneously influenced the HSS. Temperature was confirmed as the primary factor while dwell time was secondary.

Immediate opening for a post-doctoral researcher in the area of coatings tribology

Transfer printing, an emerging manufacturing technique for heterogeneous material integration, is combined with the unique mechanics of soft composite films to realize a responsive surface for tunable topography in this work. Soft composite films are fabricated by transfer printing thin silicon ribbons on elastomeric films in a staggered manner. The corrugation formation in soft composite films requires a well-organized spatial distribution of the silicon ribbons which is enabled by transfer printing processes developed here.