CAD Tools for Co-simulation and Modelling of MEMS Devices, Associated Electronics and Packaging-Part Two

Webinar

Date: April 24, 2012;  Time: 12:00 - 1:00 pm (EDT)

Overview: This talk will present how MEMS CAD
tools coupled with standard analog and digital design tools may be used
for the co-simulation and modeling of MEMS devices, their associated
electronics and packaging in commercial MEMS systems. Examples will be
given of important co-design issues such as how to simulate packaging
effects on MEMS device performance, how to co-simulate electronics and
MEMS to calculate system timing, and how to model and evaluate the
thermal, mechanical and electrical performance of new packaging concepts
such as system in package. The talk will also discuss design tools and
strategies for those system designers wishing to utilize third party or
off the shelf MEMS sub-systems. 

The webinar is Free. 

For registration, please go to:

http://lnf.umich.edu/nnin-at-michigan/index.php/2012/03/webinar-registration-2/