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High-temperature tensile behavior of freestanding Au thin films

Gi-Dong Sim's picture

In this paper, the mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340°C using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore the flow stress decreases with decreasing film thickness, contravening the usual notion that “smaller is stronger”. This behavior is attributed mainly to diffusion-facilitated grain boundary sliding.

This paper has been accepted by Scripta Materialia.

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