[MTCOMM - Elsevier - IF 3.38] Special Issue on Advanced Welding and Joining Technologies

Materials Today Communications (MTCOMM) call for papers 

Special Issue on Advanced Welding and Joining Technologies  

Recent advancements in welding and related materials joining technologies have enhanced the integrity and performance of assembled components, and have led to the development of advanced manufacturing methods. This special issue seeks experimental and/or theoretical studies covering all aspects of welding and joining, including microstructure evolution, mechanical properties, and performance in extreme environments. Characterisation and technique development studies are of interest, particularly related to the materials science of the joint. Review articles are also of interest, but topics of contributed review articles should first be discussed with the editors.

Guest editors:

Enrico Salvati, University of Udine, Italy 

Janelle P. Wharry, Purdue University, United States of America

Potential topics include, but are not limited to:

- Novel advanced welding technologies​

- Multi-scale microstructural characterisation

- Numerical and theoretical modelling of welding processes and performance

- Mechanical characterisation (e.g. strength, hardness, toughness, fatigue, creep, wear)

- Corrosion resistance

- Residual stress experimental evaluation and modelling

Manuscript submission information:

All manuscripts will be peer-reviewed in accordance with the standard practices of Materials Today Communications. For more information on Materials Today Communications, including the journal ranking and scores, publication policies, author guidelines and publication charges, please refer to the journal website at https://www.journals.elsevier.com/materials-today-communications. 

Please submit your manuscripts using the Editorial Manager web portal: https://www.editorialmanager.com/mtcomm and select the option VSI: Welding & Joining in the drop-down menu at the time of submission.

Submission Deadline: September 30th, 2022