Come to meet and mingle with the Extreme Mechanics Letters (EML) editorial board and authors at a reception during the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) to be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.
The advent of internet era has been driving some significant changes in scientific publication process. The needs for optimizing publication process, from manuscript preparation and submission, to review process and to post-publication dissemination, are ubiquitous for many disciplines. There is no exception for the mechanics field.
To this end, we are glad to announce that SES2016 will host an open forum of “Meet the Editors-in-Chief of Mechanics Journals”, which features the following panelists:
Dear colleages,
We are pleased to announce that the SES2016 mobile app is launched, for the first time in the SES conference series. It's free to download and use, available for your iOS or Android smartphones or tablets, as well as on your laptop, Windows phone, or Blackberry.
Dear Colleagues,
We are pleased to announce that Dr. Mihail C. Roco of National Science Foundation and National Nanotechnology Initiative will be the SES2016 banquet plenary speaker.
Nanotechnology and Other Grand Challenges in the United States
Mihail C. Roco
National Science Foundation and National Nanotechnology Initiative
Dear colleagues,
We are pleased to announce that the technical program of the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) is now available online at
http://ses2016.org/tracks-symposia/
(Click the link to individual symposia for detailed technical program)
Dear colleagues:
We are pleased to announce that the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) is now open for registration at
Teng and Abhijit
Co-chairs, SES2016
Dear colleagues,
You are cordially invited to submit abstract(s) to Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics at the 2016 SES meeting to be held at the University of Maryland-College Park during October 2-5, 2016. Abstracts can not be more than 350 words and are due on Wednesday, June 15, 2016.
Dear Colleagues,
The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.
We would like to invite you to submit abstracts for our symposium entitled “Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures”
Soft materials are ubiquitous in nature, from biopolymers, cells, and tissues to organs. In recent years, soft materials have been intensively explored in different engineering applications, ranging from haptic devices to soft robotics, from flexible electronics to biomimetic systems. Fundamental studies of the deformation mechanisms of soft materials and optimal designs in different applications urgently need robust methods for material characterization.
