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materials engineering

Faculty position in computational materials science and engineering at Illinois Institute of Technology

Submitted by MMAEatIIT on

Applications are invited for a tenure-track faculty position at the assistant or associate professor level in the area of computational materials science and engineering. Candidates from a range of disciplines such as materials science, chemistry, physics, chemical engineering, and mechanical engineering are all welcome to apply.

Post-Doctoral Researcher on Structural Composite Bonded Repair

Submitted by ULHRDivision on

Please see www.ul.ie/hrvacancies for details.

 

Department/
Research Centre:  Dept. of Mechanical, Aeronautical and Biomedical Engineering/ Irish Centre for Composites Research (IComp)

 

Title
of Post:    Post-Doctoral
Researcher on Structural Composite Bonded Repair

 

Contract
Type:  Specific Purpose

 

Salary:  €37,750 - €46,255 p.a.

 

University Lectureship in Solid Mechanics/Materials Engineering, University of Oxford

Submitted by acfcocks on

The Department of Engineering and St Hugh's College at Oxford University
have a University Lectureship available in the area of Solid Mechanics
and Materials Engineering.  The closing
date for applications is 31st May 2012.  Further information can be
found in the attached files.

We look forward to receiving your application.

Alan Cocks

University Lectureship in Solid Mechanics and Materials Engineering, University of Oxford

Submitted by acfcocks on

The Department of Engineering and Balliol College at Oxford University have a University Lectureship available in the area of Solid Mechanics and Materials Engineering.  We would  be particularly interested in receiving applications in the general area of composite and lightweight materials, including, polymer, metal, ceramic, biological and multifunctional composites, foams and lattice materials. The closing date for applications is 16th January 2012.  Further information can be found in the attached files.

We look forward to receiving your application.