Dear Colleagues, We would like to invite you to participate in a symposium on “Modeling and experimental characterization for the behavior of the micro/nanostructured thin films” in ASME 2014 International Mechanical Engineering Congress and Exposition in Montreal, Canada( http://www.asmeconferences.org/congress2014/).
You are cordially invited to submit an abstract to the symposium on “Emerging Methods To Understand Mechanical Behavior” at 2008 TMS annual meeting, New Orleans, LA, March 9-13, 2008.
You are cordially invited to submit an abstract to the symposium on “Emerging Methods To Understand Mechanical Behavior” at 2008 TMS annual meeting, New Orleans, LA, March 9-13, 2008.
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