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marco.paggi's picture

White paper on failures of photovoltaic modules in the field - IEA supported by ERC

ERC StG CA2PVM outreach activity on Photovoltaic durability and reliability research in collaboration with the International Energy Agency. 

An open access report for policy makers, PV investors and researchers interested in failure mechanisms of PV modules in the field has just been released and is downloadable from this link: 

http://www.iea-pvps.org/index.php?id=435

alicia's picture

Multiple postdoc openings at UC San Diego (USA) and Cardiff University (UK)

Applications are invited from highly motivated researchers for two postdoctoral positions immediately available in the Multiscale Multiphysics Design Optimisation (M2DO) lab, led by H Alicia Kim.

EMI 2016 / PMC 2016 Conference at Vanderbilt University - Abstract Submission Deadline Extended to October 31, 2015

In response to a number of requests, the abstract submission deadline for the EMI 2016 / PMC 2016 Conference at Vanderbilt University has been extended to October 31, 2015.

The event is actually two co-located conferences: the Engineering Mechanics Institute Conference 2016 (EMI 2016) and the Probabilistic Mechanics & Reliability Conference 2016 (PMC 2016). The event wil be chaired by Prof. Sankaran Mahadevan and Prof. Caglar Oskay, both of Vanderbilt University.

EMI 2016 & PMC 2016 Conferences

The event to be held on May 22-25, 2016 at Vanderbilt University in Nashville, Tennessee, is actually two co-located conferences: the Engineering Mechanics Institute Conference 2016 (EMI 2016) and the Probabilistic Mechanics & Reliability Conference 2016 (PMC 2016). The event will be chaired by Prof. Sankaran Mahadevan and Prof. Caglar Oskay, both of Vanderbilt University.

Amit Pandey's picture

Fuel Cell Ceramics Reliability Summer Intern (Rolls-Royce PLC & LG Corp.)

 Fuel Cell Ceramics Reliability Summer Intern. 

Interested candidates with a background in mechanical, material science. solid mechanics please email your resume to amit.pandey/at/lgfcs/dot/com with the subject title "Fuel Cell
Ceramics Reliability Summer Intern"

 

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LRET Lecturer/Senior Lecturer/Reader in Safety and Reliability Engineering: University of Aberdeen

School of Engineering
LRET Lecturer/Senior Lecturer/Reader in Safety and Reliability Engineering

Reference Number 1231244


Building on a 20-year track record in safety engineering, the School of Engineering at the University of Aberdeen in partnership with The Lloyd's Register Educational Trust (The LRET) is establishing a centre of excellence for research and teaching in the safety and reliability of engineering systems, structures and processes.

Frank W. DelRio's picture

ASME IMECE 2012: Symposium on Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS

Dear Colleagues:

 

We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX.  The symposium is entitled Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS and is part of the Micro- and Nano- Systems Engineering and Packaging Track.

 

Frank W. DelRio's picture

ASME IMECE 2012: Symposium on Tribology of Thin Films and Small-Scale Structures

Dear Colleagues:

We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX.  The symposium is entitled Tribology of Thin Films and Small-Scale Structures and is part of the Mechanics of Solids, Structures and Fluids Track.

 

PhD Fellowship in “Risk and Reliability in Geotechnical Engineering"

Topic: PhD Fellowship in “Risk
and Reliability of Offshore Wind Turbine Foundations”

Location: NTNU, Trondheim, Norway

Deadline: 09 Mar 2012

Salary: NOK 391 100 to NOK 448
100 per year (equivalent of approximately £43 000 to £50 000)

Xiao Hu Liu's picture

Job Opening at IBM Microelectronics: Semiconductor Process Integration Engineering Professinal

There are several openings for semiconductor process integration at IBM Microelectronics. The reqiured background is quite broad, specifically mechanical engineering background, reliability, failure analysis and modeling with experience in BEOL process and integration. To see more details and to apply online, please click the link below.

https://jobs3.netmedia1.com/cp/job_summary.jsp?job_id=STG-0424220

 

Reliability and engineering mechanics

The word "failure" can mean different things to different people.  Over the past couple of years, my interactions with various groups from industry has shown me that for some people failure means catastropic fracture/buckling while for others it can mean highly localized plastic yielding.  Even for relatively simple sandwich composite structures, there is no clearly agreed upon definition of the word.

First-order reliability method (FORM) for Matlab?

Choose a channel featured in the header of iMechanica: 

Hello,

I am wondering if there is a source code for first-order reliability method (FORM) or second-order (SORM) available out there, ideally for Matlab but others would be interesting as well.

If not, has anyone programmed this themself?  What literature source did you base it upon?

Thanks in advance for any help!

FEA Improves Reliability of Flip-Chip Packaging

On Aug 10, 2009, Semiconductor International (SI) Newsbreak published a report on my work in AMD about 3D fracture study of underfill delamination as the top story in that issue.  I have never imagined that. Except the pleasure I received from this good news, I wonder if this work is also interesting to iMechanica community.  For that reason, I attach here the SI news report and the original paper published on ITherm2008 Proceedings. Welcome any comments and thoughts.

Position "Lead Mechanical Engineer IV" in Germany

Reliability
Analysis Associates, Inc.

1440 North Lake Shore Drive, #30F,
Chicago, IL 60610

Phone:
312-274-0542;  Fax: 312-274-0574;  E-mail: reliability@nidus.com

Specializing in
the recruitment of Reliability, Maintainability,

Rui Huang's picture

Journal Club Theme of March 15: Impact of Chip-Package Interaction on Reliability of Copper/Low k Interconnects and Beyond

Choose a channel featured in the header of iMechanica: 

The exponential growth in integrated device density has yielded high-performance microprocessors containing almost 1 billion transistors per chip for the current 65 nm technology. Continuous scaling of the devices and performance requires innovations in materials, processes, and designs for both back-end-of-line (BEoL) interconnects and packaging structures. Mechanical reliability has been a limiting factor for implementation of new materials and processes.

Seeking candidates for positions in Houston, also positions in Germany

Our agency, Reliability Analysis Associates, Inc., specializes in recruiting Reliability Engineers and related skills.   For a client in the oil business in Houston, TX we are seeking candidates for two positions that require knowlege of finite element analysis, crack growth, reliability, and low cycle fatigue.   The two job descriptions are attached.

 

August Workshop on Materials Characterization for Nanoscale Reliability

We invite you to participate in the upcoming Workshop on Materials Characterization for Nanoscale Reliability, to take place 14-16 August, 2007 at the University of Colorado in Boulder, Colorado. Details are posted at http://www.boulder.nist.gov/div853/Nanoscale_Reliability_workshop/index.htm.

Jun He's picture

Materials Impact on Interconnects Process Technology and Reliability

M.A. Hussein and Jun He (Intel Corporation)

IEEE Transactions on Semiconductor Manufacturing, vol. 18, No. 1, p.69-85, 2005

In this work, we explain how the manufacturing technology and reliability for advanced interconnects is impacted by the choice of metallization and interlayer dielectric (ILD) materials. The replacement of aluminum alloys by copper, as the metal of choice at the 130nm technology node, mandated notable changes in integration, metallization, and patterning technologies. Those changes directly impacted the reliability performance of the interconnect system. Although further improvement in interconnect performance is being pursued through utilizing progressively lower dielectric constant (low-k) ILD materials from one technology node to another, the inherent weak mechanical strength of low-k ILDs and the potential for degradation in the dielectric constant during processing, pose serious challenges to the implementation of such materials in high volume manufacturing. We will consider the cases of two ILD materials; carbon-doped silicon dioxide (CDO) and low-k spin-on-polymer to illustrate the impact of ILD choice on the process technology and reliability of copper interconnects. preprint pdf 2.49 MB

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