Confirmed Invited Speakers:

Philip Kim (Harvard University)

Huajian Gao (Brown University)

Markus Buehler (MIT)

Xi Chen (Columbia University)

Harold Park (Boston University)

Evan Reed (Stanford University)

A new computational technique for modeling dislocation interactions with shearable and non-shearable precipitates within the line dislocation dynamics framework is presented. While shearable precipitates are modeled by defining a resistance function, non-shearable ones are modeled by drawing a comparison between the two well-known Orowan and Frank–Read mechanisms. The precipitates are modeled directly within the dislocation dynamics analysis without the need for any additional numerical methods.

Dear Colleagues:

Please consider submitting abstracts to Symposium E-8: Dynamic Failure, Fragmentation, and Localization at the 53rd Annual Technical Meeting of the Society of Engineering Science to be held at the University of Maryland at College Park, October 2-5, 2016. 

The deadline for abstracts is June 15th, 2016. 

Dear colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.  

We have openings for post docs and grad students to develop and use atomistic simulations to investigate surface and interface phenomena. Specific research focuses will depend on the applicant’s background, but may include characterization of the interactions and reactions between metallic surfaces and various industrially-relevant liquid adsorbates and exploration of the effects of coupled stresses in determining the size of the contact between nanoscale bodies.

Applications are invited for two postdoctoral fellowships, attached to the South African Research Chair in Computational Mechanics at the University of Cape Town, South Africa. Preference will be given to candidates with experience in one or more of the following areas: finite element methods for GPUs; preconditioned solvers in nonlinear mechanics; operator-splitting methods for coupled problems. 

Dear Colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center. 

We would like to invite you to submit abstracts for our symposium entitled “Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures”

Dear Colleagues,

Please consider submitting abstract(s) to Symposium D-11 "Instability and Interfacial Adhesions in Bio-Compatible Electronics" at the 2016 SES meeting to be held at the University of Maryland-College Park During October 2-5, 2016.  Abstract due: June 15, 2016.

Dear Colleagues,

You are warmly invited to submit your one-page abstract to our Symposium E-3: Advanced Nano-Manufacturing for Multi-functional Nanosystems for the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016)  

Deadline for submission of Abstracts is June 15, 2016. 

Co-organizers:

The 53rd Annual Technical Meeting of the Society of Engineering Science will be held at the University of Maryland (UMD), 2-5 October 2016. We are organizing a symposium on Architectured Metamaterials which will cover research on the structure, mechanics, design, optimization, fabrication and mechanical performance of all categories of architectured materials including but not limited to lattice materials, metamaterials, topologically interlocked materials and bio-inspired materials. We expect that the SES meeting and this symposium will offer a great platfor